Liquid Metal Model：Fill-LM S7200

What is the Liquid Metal Fill-LM S7200?

Fill-LM S7200 is a high performance thermal conductive interface material of bismuth based alloys, which overcomes the disadvantages of weak ductility, inadequate surface wetting and complicated operation process of pure liquid metal. The product has good reliability and ductility, which can fill the gap between the interfaces well and greatly reduce the contact thermal resistance. The physical and

chemical properties of the product are stable, and it can still work normally in high temperature environment for a long time, which is much higher than other thermal conductive interface materials. Fill-LM S7200 is designed for high power devices. It is easy to operate, and can be supplied as sheet to meet application environments.