Liquid Metal Model：Fill-LM SP8000

What is the Liquid Metal Fill-LM SP8000?

Fill-LM S8000 is a high performance thermal conductive interface material of indium based alloys, which overcomes the disadvantages of weak ductility, inadequate surface wetting and complicated operation process of pure liquid metal. The product has good reliability and ductility, which can fill the gap between the interfaces well and greatly reduce the contact thermal resistance. The physical and chemical properties of the product are stable, and it can still work normally in high temperature environment for a long time, which is much higher than other thermal conductive interface materials. Fill-LM S8000 is designed for high power devices. It is simple to operate, and can be supplied as gap pad to meet application environments.