Liquid Metal Model:Fill-LM S6000
≥60W/mK liquid metal:Fill-LM S6000
- Extremely high thermal conductivity
- Ultra-low thermal resistance
- High reliability, no pump out/dry out in long term application
- Safe and environmentally friendly, not volatile
- High temperature tolerance
- Compatible with all coolants in immersion environments
- Datasheet

What is the Liquid Metal Fill-LM S6000?
Fill-LM S6000 is a high performance thermal conductive interface material of bismuth based alloys, which overcomes the disadvantages of weak ductility, inadequate surface wetting and complicated operation process of pure liquid metal. The product has good reliability and ductility, which can fill the gap between the interfaces well and greatly reduce the contact thermal resistance. The physical and
chemical properties of the product are stable, and it can still work normally in high temperature environment for a long time, which is much higher than other thermal conductive interface materials. Fill-LM S6000 is designed for high power devices. It is easy to operate, and can be supplied as sheet to meet application environments


What are the main application scenarios for Fill-LM S6000?
The typical applications of Liquid Metal Fill-LM S6000
CPU, GPU and other chip-set
LED, laser and other optical devices
Servers, liquid cooling data center
Aerospace, military radar TR components
Automotive Electronics
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