Industry Application

Thermal Solution for Network Switches   Background Driven by rapid AI iteration and surging computing power, data centers are stepping into high power density era. Network switches feature highly integrated onboard components including optical modules, power ICs and computing chips. Concentrated heat flux and limited PCB space bring severe thermal

Thermal Conductivity Solutions for Optical Modules   Background Driven by surging demand for AI computing power, the optical module market is experiencing explosive growth. With rapid iterations of 800G and 1.6T products, power consumption of single modules has risen to 25–45W, creating an increasingly severe conflict between high power draw