Fueled by data centers, cloud computing and AI, high-speed optical modules (800G/1.6T/3.2T) are advancing toward higher bandwidth, smaller footprints and higher power density. This trend creates severe thermal challenges, raising strict requirements for premium thermal interface materials to avoid overheating and thermal failure.
Tailored for next-gen high-speed optical modules,Techinno’s one-part post-cure thermal gel Fill-CIP 1120 provides a reliable, high-performance thermal management solution for stable component operation.
Key Product Advantages
1.Superior Thermal Conductivity
With a thermal conductivity of 12.0 W/m-K, the gel wets contact surfaces thoroughly to fill gaps and compensate for component tolerances, minimizing interfacial thermal resistance. It achieves ultra-thin bond line thickness (BLT) under low pressure to keep critical components within safe operating temperatures.
2.Low Outgassing & Low Oil Bleed
Silicone bleed and volatile small molecules severely impair optical component stability. As a single-component silicone thermal gel, Fill-CIP 1120 features ultra-low outgassing and oil bleed with measured ΣD3-D10 < 50 ppm, preserving optical precision and signal integrity.
3.High Dispensing Efficiency & Smooth Flow
Low viscosity enables seamless dispensing with no stringing during cut-off. The one-part formula eliminates two-part mixing, boosting production throughput.
At 90 psi with a 2.5 mm nozzle, it delivers a flow rate up to 25 g/min, fully compatible with high-volume automated assembly lines.
4.Long-Term Reliability & Repairability
Thermal resistance remains consistent through high-temperature aging, thermal shock and 85°C/85% RH humidity cycling, with no degradation in thermal performance over reliability testing.
Summary
Techinno Fill-CIP 1120 single-component post-cure thermal gel combines smooth, high-speed dispensing for mass automation with high thermal conductivity, ultra-low outgassing/oil bleed and outstanding long-term reliability — an all-in-one high-performance thermal solution for next-gen high-speed optical modules.
