1.Thermal Management Solutions for AI Server Chips:
Cold Plate & Immersion Liquid Cooling Dual Routes
Driven by surging AI computing loads, CPU, GPU and TPU chips generate massive heat, with liquid cooling rapidly replacing air cooling. Cold plate liquid cooling stands as the mainstream choice for liquid-cooled data centers thanks to outstanding energy efficiency and mature technology. However, traditional TIMs suffer pump-out and dry-out under high heat flux and thermal cycling, leading to rising thermal resistance and raising higher standards for thermal interface materials.
Cold Plate Liquid Cooling
Application Requirements
-Good wettability & gap-filling capacity
-High anti-pump-out reliability, ultra-low BLT & thermal resistance
-Large tolerance to absorb 0.1–0.3 mm warpage of large-size chips
-Prevent bare die cracking risks
Recommended Products
Phase Change Materials Fill-PCM 800 Series
-Extremely low thermal resistance
-Silicone-free, no silicon contamination
-Sheet products have natural tacky, stick on the surface of heat sink directly, no additional adhesive
-Paste-like products have low viscosity, easy to print
-High reliability, no pump out/dry out/crack/slump in long term application
-Good handling and reworkability
-Soft at room temperature, less stress on board during assembly
Ultra Thin TIM Fill-TPM 800
-Extremely low thermal resistance
-Silicone free, no silicone contamination
-High reliability, no pump out/dry out/crack/slump in long term application
-Superior self-healing capability, effectively mitigating pump-out induced by Laser device warpage of large-sized chips
-Good handling and reworkability
-Soft at room temperature, less stress on board during assembly
Immersion Liquid Cooling
Application Requirements
Compatible with all coolants, no contamination to extend coolant service life
Superior gap filling & low thermal resistance
Long-term stable reliability
Easy assembly for mass production
Recommended Products
Liquid Metal Sheet Fill-LM SP5000
-Extremely high thermal conductivity
-Ultra-low thermal resistance
-High reliability, no pump out/dry out in long term application
-Safe and environmentally friendly, not volatile
-High temperature tolerance
-Compatible with all coolants in immersion environments
Liquid Metal Sheet Fill-LM SP8000
-Extremely high thermal conductivity
-Ultra-low thermal resistance
-High reliability, no pump out/dry out in long term application
-Safe and environmentally friendly, not volatile
-High temperature tolerance
-Compatible with all coolants in immersion environments
2. Board-Level Thermal Management Solutions
For memory chips, capacitors, inductors, PMICs on server & switch motherboards
Highly integrated hardware of servers and switches stacks dense components including CPU, GPU and optical modules, bringing multiple thermal challenges: local high heat flux triggers frequency throttling, excessive interfacial thermal resistance weakens cooling efficiency, and sensitive components are vulnerable to mechanical stress. TIMs must meet strict standards of high thermal conductivity, low stress and long-term reliability.
Application Requirements
High thermal conductivity
Excellent gap filling with low stress
Durable long-term reliability
Low oil bleed to avoid PCB contamination
Electrical insulation
Easy assembly & automated dispensing
Ultra-Soft Thermal Pads
Fill-US1200 (12 W/m-K)
Fill-US1400 (14 W/m-K)
Fill-US1400 (14 W/m-K)
Fill-US1600 (16W/m-K)
High deformation under low compression, low oil bleed. Maintains proper residual stress after thermal shock to secure consistent interface contact and stable heat conduction.
Thermal Gel Pads
Fill-PT800 (3.5 W/m-K)
Fill-PT1200 (8 W/m-K)
Ultra-soft gel pads with 70% compressibility to absorb large tolerances and protect delicate components with low stress. Molded from thermal gel, the special structure delivers large deformation under tiny compression force, minimizing residual stress and mechanical impact on precision electronics while filling uneven gaps.
General board-level options: PT350GN / PT600, one-part & two-part thermal gels
3. Optical Modules: Internal & External Coordinated Precision Cooling
Booming AI computing accelerates adoption of 800G and 1.6T high-speed optical modules. Rising power density and limited internal space, together with repeated plug-unplug cycles, cause TIM abrasion, detachment and high thermal resistance, while traditional cooling solutions cannot eliminate failure risks under intense heat flux.
External Module: Pluggable TIM T-Plug 820S
-Tear resistance to plug in & out
-Low interfacial thermal resistance
-High reliability
-Good reworkability
-No leakage without enclosure
Internal Module: Cure-In-Place Gap Filler Fill-CIP 1120
-Thermal conductivity: 12.0W/m-K
-Single-part post-cure material, easy for auto-dispensing
-Good surface wetting
-High reliability and thermal stability
-No pump out
-Good long-term reliability
For sample requests or technical consultation, please submit inquiries via our official website.
——Techinno, Remove Heat Bottlenecks for Computing Power
