Thermally Conductive Pad: Fill-Pad US450

What is the Thermally Conductive Pad Fill-Pad US450？

Techinno Fill-Pad US450 is a high performance gap filler material which combines 4.5W/m-K thermal conductivity with high resilience. The unique formula design enables it to maintain good mechanical strength, have the tension and bending resistance, have good surface wetting property to minimize interface thermal resistance, and have good handling, that can be well applied in various working conditions and ensure its integrity. The product has excellent mechanical properties and extremely low oil bleeding while having high thermal conductivity, which can effectively protect electronic devices from damage and pollution in applications. It’s especially suitable for the automobile industry.

The standard product is naturally tacky on both sides and requires no additional adhesive for mating. Non-tacky treatment on one side is also available for some special applications. It can also be coated on one side of PI film to enhance electricalinsulation.