Thermally Conductive Pad: Fill-Pad US800
8.0W/mK Thermally Conductive Pad: Fill-Pad US800
- Thermal Conductivity: 8.0W/m-K
- Good surface wetting property
- Low compression force
- High compressibility
- Low oil bleeding
- Low outgassing, ∑D3 -D10 (< 100ppm)
- Datasheet
What is the Thermally Conductive Pad Fill-Pad US800？
Techinno Fill-Pad US800 is a high performance gap pad material which combines 8.0W/m-K thermal conductivity with high compressibility under low pressure. It is designed for high power and high heat applications requiring low compression force to conform over large dimensional variances or multiple gaps. The unique formula enables low compression stress while also remaining minimal residual stress on components. Its good surface wetting capability minimizes the interface thermal impedance. Fill-Pad US800 is especially suitable for applications which is sensitive to siloxane volatiles. It has very low outgassing and low oil bleeding performance.
What are the main application scenarios for Fill-Pad US800?
The typical applications of Thermally Conductive Pad: Fill-Pad US800
Telecommunications, wireless infrastructure & network servers
Optical modules
Automotive electronics
Hard disk drives and solid hard disk memory devices
Industry, LED lighting and power modules
