Thermally Conductive Pad: Fill-Pad US600
6.0W/mK Thermally Conductive Pad: Fill-Pad US600
- Thermal Conductivity: 6.0W/m-K
- Naturally tacky or tack-free on one side available
- Good surface wetting
- Low contact resistance
- High compressibility under low pressure
- High flexibility
- Datasheet
What is the Thermally Conductive Pad Fill-Pad US600？
Techinno Fill-Pad US600 is a high performance gap filler material which combines 6.0W/m-K thermal conductivity with excellent pressure versus deflection characteristics. The unique formula achieves minimal compression stress and residual stress on components while also yielding optimized surface wetting and low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device. Fill-Pad US600 as a standard product is naturally tacky on both sides and requires no additional adhesive for mating. Non-tacky treatment in one side is also available for some special applications.
What are the main application scenarios for Fill-Pad US600?
The typical applications of Thermally Conductive Pad: Fill-Pad US600
Automotive electronics
Telecommunications, wireless infrastructure
Memory module, SSD
Industry, LED lighting and power modules
LCD, PDP and Laser TV displays
