Thermally Conductive Phase Change Materials Model：Fill-PCM 550/550SP
5.5W/mK thermally conductive phase change material Fill-PCM 550/550SP
- Extremely low thermal resistance
- Silicone free, no silicone contamination
- Natural tacky, stick on the surface of heat sink directly, no additional adhesive
- High reliability, no pump out/dry out/crack/slump in long term application
- Good handling and reworkability
- Soft at room temperature, less stress on board during assembly
- Datasheet
What is the Thermal Conductive Phase Change Composite Material Fill-PCM 550/550SP?
Phase Change Material (PCM) is designed to minimize thermal resistance between high power component and heat sink, and offers very stable thermal resistance to enhance the reliability of the device. Its excellent gap-filling capability is easy to get extremely low surface contact thermal resistance, and improve overall heat dissipation efficiency.
Fill-PCM 550 is a high performance thermal phase change material which offers 5.5W/m-K thermal conductivity with high reliability. Its soft property at room temperature and surface tack make the product good for application and reworkability. Fill-PCM 550 is designed to meet the demanding requirements of today’s high performance electronic equipments for heat dissipation, which provides superior reliability and maintains low thermal impedance. Fill-PCM 550 can be supplied as cut parts in rolls, sheets or other customized shapes. Techinno also offers printable version Fill-PCM 550SP in order to meet various application needs of customers.
What are the main application scenarios for Fill-PCM 550/550SP?
The typical applications of Fill-PCM 550/550SP
Notebooks；
Desktops；
Graphic processing chips；
Memory devices；
Consumer Electronics；
Automotive；
TV, game console, etc
