Thermally Conductive Phase Change Materials Model：Fill-PCM P400

What is the Thermal Conductive Phase Change Composite Material Fill-PCM P400?

Fill-PCM P400 is a high performance thermal phase change composite. The product is based on polyimide film as the substrate and is covered with high thermal conductivity phase change material on both sides. The polyimide film as the middle layer of the sandwich structure gives the material good handling, electrical insulation and puncture resistance, while the phase change composite on both sides provide excellent interface wetting and reduce the interfacial thermal resistance. Fill-PCM P400 is designed to meet the demanding requirements of high power semiconductors or high performance electronic equipment for heat dissipation, which provide excellent thermal conductivity and insulation performance, especially for the IGBT industry. Fill-PCM P400 is protected by the release liner and can be supplied as cut parts in rolls, sheets or other customized shapes.