Thermally Conductive Phase Change Materials Model:Fill-PCM P200
2.0W/mK thermally conductive phase change material Fill-PCM P200
- Extremely low thermal resistance
- Silicone free, no silicone contamination
- High insulation
- High puncture resistance
- Good reworkability
- High reliability
- Datasheet

What is the Thermal Conductive Phase Change Composite Material Fill-PCM P200?
Fill-PCM P200 is a high performance thermal phase change composite. The product is based on polyimide film as the substrate and is covered with high thermal conductivity phase change material on both sides. Fill-PCM P200 is designed to meet the demanding requirements of today’s high performance electronic equipment for heat dissipation, which provides excellent thermal conductivity and insulation performance. Fill-PCM P200 can be supplied as cut parts in rolls, sheets or other customized shapes.


What are the main application scenarios for Fill-PCM P200?
The typical applications of Fill-PCM P200
Power Semiconductors and Modules;
Automotive;
Graphic processing chips;
Memory devices;
Consumer Electronics







