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Thermally Conductive Phase Change Materials Model:Fill-PCM P200

2.0W/mK thermally conductive phase change material Fill-PCM P200

  • Extremely low thermal resistance
  • Silicone free, no silicone contamination
  • High insulation
  • High puncture resistance
  • Good reworkability
  • High reliability

What is the Thermal Conductive Phase Change Composite Material Fill-PCM P200?

Fill-PCM P200 is a high performance thermal phase change composite. The product is based on polyimide film as the substrate and is covered with high thermal conductivity phase change material on both sides. Fill-PCM P200 is designed to meet the demanding requirements of today’s high performance electronic equipment for heat dissipation, which provides excellent thermal conductivity and insulation performance. Fill-PCM P200 can be supplied as cut parts in rolls, sheets or other customized shapes.

What are the main application scenarios for Fill-PCM P200?

The typical applications of Fill-PCM P200

Power Semiconductors and Modules;
Automotive;
Graphic processing chips;
Memory devices;
Consumer Electronics

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