Thermally Conductive Phase Change Materials Model：Fill-PCM 300/300SP
Techinno Thermally Conductive Phase Change Material Fill-PCM 300/300SP is designed to completely fill interfacial air gaps, get extremely low surface contact thermal resistance and improve overall heat dissipation efficiency.
- Extremely low thermal resistance
- Silicone free, no silicone contamination
- Natural tacky, stick on the surface of heat sink directly, no additional adhesive
- High reliability, no pump out/dry out/crack in long term application
- Good handling and reworkability
- Soft at room temperature, less stress on board during assembly
- Datasheet
What is the Thermal Conductive Phase Change Composite Material Fi11-PCM300 Series?
Phase Change Material (PCM) is designed to minimize thermal resistance between high power component and heat sink, and offers very stable thermal resistance to enhance the reliability of the device. Its excellent gap-filling capability is easy to get extremely low surface contact thermal resistance, and improve overall heat dissipation efficiency.
Fill-PCM 300 is a high performance thermal phase change material which offers 3.0W/m-K thermal conductivity. Its soft properties at room temperature and suitable surface tack make the product good for application and reworkability.
Fill-PCM 300 is designed to meet the harsh requirements of high performance electronic equipments for heat dissipation, which provides superior reliability and maintains low thermal impedance. Fill-PCM 300 can be supplied as cut parts in rolls, sheets or other customized shapes. Techinno also offers printable version Fill-PCM300SP in order to meet various application needs of customers.
What are the main application scenarios for Fill-PCM 300/300SP?
Fill‑PCM 300/300SP is a high‑performance phase change thermal interface material. With its low thermal resistance and high reliability characteristics, it is widely used in electronic devices that require efficient heat dissipation. Major application scenarios include:
Laptop Applications；
Desktop Computer Applications；
Graphics Processors (GPU)；
Memory Devices；
Consumer Electronics；
Automotive Electronics；
Home Entertainment Devices (TVs, Game Consoles, etc.)
