Thermally Conductive Phase Change Materials Model：FilI-PCM 400/400SP
4.0W/mK thermally conductive phase change material:Fill-PCM 400/400SP
- Extremely low thermal resistance
- Silicone free, no silicone contamination
- Natural tacky, stick on the surface of heat sink directly, no additional adhesive
- High reliability, no pump out/dry out/crack/slump in long term application
- Good handling and reworkability
- Soft at room temperature, less stress on board during assembly
- Datasheet
What is the Thermal Conductive Phase Change Composite Material Fill-PCM 400/400SP?
Phase Change Material (PCM) is designed to minimize thermal resistance between high power component and heat sink, and offers very stable thermal resistance to enhance the reliability of the device. Its excellent gap-filling capability is easy to get extremely low surface contact thermal resistance, and improve overall heat dissipation efficiency. Fill-PCM400 is a high performance thermal phase change material which offers 4.0W/m-K thermal conductivity. Its soft properties at room temperature and surface tack make the product good for application and reworkability. Fill-PCM 400 is designed to meet the harsh requirements of high performance electronic equipments for heat dissipation, which provides superior reliability and maintains low thermal impedance. Fill-PCM 400 can be supplied as cut parts in rolls sheets or other customized shapes. Techinno also offers printable version Fill-PCM 400SP in order to meet various application needs of customers.
What are the main application scenarios for Fill-PCM 400/400SP?
The typical applications of Fill-PCM 400/400SP
Notebooks；
Desktops computers；
Graphic processing chips；
Memory devices；
Consumer Electronics；
Automotive；
TV, game console, etc
