Thermally Conductive Phase Change Materials Model：Fill-PCM 900/900SP
9.0W/mK thermally conductive phase change material Fill-PCM 900/900SP
- Extremely low thermal resistance
- Silicone free, no silicone contamination
- Sheet products have natural tacky, stick on the surface of heat sink directly,no additional adhesive
- Paste-like products have low viscosity, easy to print
- High reliability, no pump out/dry out/crack/slump in long term application
- Good handling and reworkability
- Soft at room temperature, less stress on board during assembly
- Datasheet
What is the Thermal Conductive Phase Change Composite Material Fill-PCM 900/900SP?
Phase Change Material (PCM) is designed to minimize thermal resistance between high power component and heat sink, and offers very stable thermal resistance to enhance the reliability of the device. Its excellent gap-filling capability is easy to get extremely low contact thermal resistance, and improve overall heat dissipation efficiency.
Fill-PCM 900 is a high performance thermal phase change material and the thermal conductivity is 9.0W/m-K. Its soft property at room temperature makes the product good for application and reworkability. Fill-PCM 900 is designed to meet the harsh requirements of high performance electronic equipments for heat dissipation, which provides superior reliability and maintains low thermal impedance. Fill-PCM 900 can be supplied as cut parts in rolls, sheets or other customized shapes. Techinno also offers printable version Fill-PCM 900SP in order to meet various application needs of customers.
What are the main application scenarios for Fill-PCM 900/900SP?
The typical applications of Fill-PCM 900/900SP
CPU, GPU, and other chipset；
IGBT Module；
Memory Modules；
Consumer Electronics；
Automotive；
TV, game console, etc
