Liquid Metal Model：Fill-LM SW8000

What is the Liquid Metal Fill-LM SW8000?

Fill-LM SW8000 is a high performance thermal conductive interface material of indium-based alloys, with an extremely high thermal conductivity of 80W/m-K. LM-SW8000 adopts sandwich-like structure of Bi-alloy/In/Bi-alloy, where the low melting point alloy can generate a low melting point alloy layer both on the upper and lower surfaces of indium sheet when product works under a certain temperature. The liquefaction of BiInSn can effectively eliminate the interface thermal resistance and will not leakage, integrating the characteristics of high thermal conductivity, low thermal resistance and high reliability. The physical and chemical properties of the product are stable, and it can still work normally in high temperature environment for a long time, which is much higher than the polymer-based thermal interface materials. Fill-LM SW8000 is designed for high power devices. It is simple to operate, and can be supplied as gap pad to meet different application environments.