Thermally Conductive TPM：Fill-TPM 800
8.0W/mK Thermally Conductive TPM Fill-TPM 800
- Extremely low thermal resistance
- Silicone free, no silicone contamination
- High reliability, no pump out/dry out/crack/slump in long term application
- Superior self-healing capability, effectively mitigating pump-out induced by warpage of large-sized chips
- Good handling and reworkability
- Soft at room temperature, less stress on board during assembly
- Datasheet
What is the Thermally Conductive TPM Fill-TPM 800?
Fill-TPM Series is designed to minimize thermal resistance between high power component and heat sink, and offers very stable thermal resistance to enhance the reliability of the device. Its excellent gap-filling capability is easy to get extremely low contact thermal resistance, and improve overall heat dissipation efficiency.
Fill-TPM 800 is a high performance thermal conductive material and the thermal conductivity is 8.0W/m-K. Its soft property at room temperature makes the product good for application and reworkability. Fill-TPM 800 is designed to meet the harsh requirements of high performance electronic equipments for heat dissipation, which provides superior reliability and maintains low thermal impedance. Fill-TPM 800 can be supplied as cut parts in rolls, sheets or other customized shapes.
What are the main application scenarios for Fill-TPM 800?
The typical applications of Thermally Conductive TPM Fill-TPM 800
CPU,GPU, ASIC, LPU, and other chipset
Automotive domain controller
Gaming laptop
Laser device
