Thermally Conductive Gels Model：Fill-Gel 350G
3.5W/mK Thermally Conductive Gel: Fill-Gel 350G
- Thermal Conductivity: 3.5W/m-K
- No post cure, easily dispensable and reworkable
- Soft and low stress
- High reliability and thermal stability
- No pump-out, no crack/slide at thermal cycling and vibration environment
- Datasheet
What is the Thermally Conductive Gel Fill-Gel 350G?
Fill-Gel 350G is a single-part and fully cured silicone gel, requiring no mixing or curing. Based on its high thixotropy and flexibility, Fill-Gel 350G is an ideal type of material for filling gaps of different heights under lower pressure, and suitable for the scene where multiple heating components share one heat sink. It is specially formulated for applications demanding low stress to protect sensitive electronic
components.With the special formula design, Fill-Gel 350G can maintain wettability for a long time and will not dry out. It has excellent cracking and slumping down resistance, can be adapted to a variety of application environments and fields. The material can be applied by automatic dispensing, and suitable for rework and field repair situation, and reduce the difficulty of construction.
What are the main application scenarios for Fill-Gel 350G?
The typical applications of Thermally Conductive Gel Fill-Gel 350G
Chassis or related cooling modules
LED lighting
Smart terminals, mobile phone, tablet computer
Communication equipment
SSD
ECU controller for new energy vehicles
