Thermally Conductive Gels Model：Fill-Gel 1000
10.0W/mK Thermally Conductive Gel: Fill-Gel 1000
- Thermal Conductivity: 10.0W/m-K
- High reliability and thermal stability
- No post cure, easily for auto-dispensing
- Low siloxane content
- High compressibility for low stress applications
- Low contact thermal resistance
- No pump-out, no crack/slide at thermal cycling and vibration environment
- Datasheet
What is the Thermally Conductive Gel Fill-Gel 1000?
Fill-Gel 1000 is a single-part silicone gel, requiring no mixing or curing. Based on its high thixotropy and flexibility, Fill-Gel 1000 is an ideal type of material for filling gaps of different heights under lower pressure, and suitable for high-power heat generating components such as base stations, servers, switches, optical modules, consumer electronics, and so on. Furthermore, it is also used in electronic components requiring low mechanical stress to protect sensitive electronic components from damage.
Fill-Gel 1000 has high thermal conductivity of 10W/m-K. The formula design gives it higher thermal conductivity, and the product has excellent anti-sag reliability, good resistance to crack and low volatility. The material can be applied by automatic dispensing with high dispense rate to improve productivity.
What are the main application scenarios for Fill-Gel 1000?
The typical applications of Thermally Conductive Gel Fill-Gel 1000
Chassis or the associated cooling module
Heating device requiring low assembly pressure
Smart terminals, mobile phone, tablet computer
Telecommunication base station
Large storage data center
Memory & Power Modules
