Thermally Conductive Gels Model：Gels Fill-Gel 600
6.0W/mK Thermally Conductive Gel: Fill-Gel 600
- Thermal Conductivity: 6.0W/m-K
- High reliability and thermal stability
- No post cure, easily for auto-dispensing
- Low oil bleeding
- High compressibility for low stress applications
- Low contact thermal resistance
- No pump-out, no crack/slide at thermal cycling and vibration environment
- Datasheet
What is the Thermally Conductive Gel Fill-Gel 600?
Fill-Gel 600 is a single part dispensable silicone gel which has high thermal conductivity of 6.0W/m-K and good reliability performance. The unique formulation makes it very soft and ideal for applications where large gap tolerances are present and filling variable gaps between multiple components and a common heat sink and in which traditional gap filler pads may apply added pressure on components. Fill-Gel 600 has excellent vertical reliability and good resistance to decline and crack, which is especially suitable for communication industry applications. It requires no mixing or curing before using, and is very ideal for automatic dispensing application.
What are the main application scenarios for Fill-Gel 600?
The typical applications of Thermally Conductive Gel Fill-Gel 600
Chassis or the associated cooling module
Heating device requiring low assembly pressure
Smart terminals, mobile phone, tablet computer
Telecommunication base station
Large storage data center
Memory & Power Modules
