Thermally Conductive Gels Model:Fill-Gel 700
7.0W/mK Thermally Conductive Gel: Fill-Gel 700
- Thermal Conductivity: 7.0W/m-K
- No post cure, easily dispensable and printable
- Good surface wetting and low stress
- High reliability and thermal stability
- No pump-out, no crack/slide at thermal cycling and vibration environment
- Datasheet

What is the Thermally Conductive Gel Fill-Gel 700?
Fill-Gel 700 is a single-part and post-curing-free silicone gel, which is designed as an ideal type of material for filling gaps of different heights under lower pressure. It has high thixotropy and flexibility, and is suitable for the scene where multiple heating components share one heat sink. The unique formula achieves minimal compression stress on components while also yielding optimized surface wetting and lower thermal resistance. Fill-Gel 700 has high thermal conductivity of 7.0W/m-K. The cross-linked gel structure provides superior long term reliability over conventional greases in harsh temperature cycling and shock & vibration. The material can be applied by automatic dispensing or stencil printing, and suitable for rework and field repair situation.


What are the main application scenarios for Fill-Gel 700?
The typical applications of Thermally Conductive Gel Fill-Gel 700
Chassis or the associated cooling module
LED lighting
Smart terminals, mobile phone, tablet computer
Telecommunication base station
Memory & Power Modules
IGBT







