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Thermally Conductive Gels Model:Fill-Gel 800

8.0W/mK Thermally Conductive Gel: Fill-Gel 800

  • Thermal Conductivity: 8.0W/m-K
  • High reliability and thermal stability
  • No post cure, easily for auto-dispensing
  • Low siloxane content
  • High compressibility for low stress applications
  • Low contact thermal resistance
  • No pump-out, no crack/slide at thermal cycling and vibration environment

What is the Thermally Conductive Gel Fill-Gel 800?

Fill-Gel 800 is a single-part silicone gel, requiring no mixing or curing. Based on its high thixotropy and flexibility, Fill-Gel 800 is an ideal type of material for filling gaps of different heights under lower pressure, and suitable for the scene where multiple heating components share one heat sink. Furthermore, it is also used in electronic components requiring low mechanical stress to protect sensitive electronic components from damage.

Fill-Gel 800 has high thermal conductivity of 8.0W/m-K. The formula design not only has higher thermal conductivity, but also has a lower BLT, so the material has excellent surface wetting, as well as lower thermal resistance. The product has excellent vertical reliability, good resistance to decline and crack and low volatility, which can maintain its own integrity in applications and reduce contamination of components. The material can be applied by automatic dispensing with high dispense rate for improved productivity and suitable for rework and field repair situation.

What are the main application scenarios for Fill-Gel 800?

The typical applications of Thermally Conductive Gel Fill-Gel 800

Chassis or the associated cooling module
Heating device requiring low assembly pressure
Smart terminals, mobile phone, tablet computer
Telecommunication base station
Large storage data center
Memory & Power Modules

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