Thermally Conductive Pad: Fill-Pad US750
7.5W/mK Thermally Conductive Pad: Fill-Pad US750
- Thermal Conductivity: 7.5W/m-K
- Good surface wetting property
- Good surface wetting
- Naturally tacky or available with tack-free on one side
- High compressibility for low stress applications
- Flexibility
- Datasheet
What is the Thermally Conductive Pad Fill-Pad US750？
Techinno Fill-Pad US750 is a high performance gap pad material which combines 7.5W/m-K thermal conductivity with high compressibility under low pressure. It is designed for high power and high heat applications requiring low compression force to conform over large dimensional variances or multiple gaps. The unique formula enables low compression stress while also remaining minimal residual stress on components. Its good surface wetting capability minimizes the interface thermal resistance. Fill-Pad US750 as a standard product is naturally tacky on both sides and requires no additional adhesive for mating. Non-tacky treatment on one side is also available for some special applications.
What are the main application scenarios for Fill-Pad US750?
The typical applications of Thermally Conductive Pad: Fill-Pad US750
Telecommunications, wireless infrastructure & network servers
Optical modules
Automotive electronics
Hard disk drives and solid hard disk memory devices
Industry, LED lighting and power modules
