Thermally Conductive Pad: Fill-Pad US1600
16.0W/mK Thermally Conductive Pad: Fill-Pad US1600
- Thermal Conductivity: 16.0W/m-K
- Good surface wetting property
- Good insulation
- Low volatility
- Low oil bleeding
- No glass fibre reinforcement required
- Datasheet
What is the Thermally Conductive Pad Fill-Pad US1600？
Techinno Fill-Pad US1600 is a high performance gap pad material with a thermal conductivity of 16.0 W/m-K. It is designed for applications with high thermal performance requirements. The unique formula enables the operation without glass fibre reinforcement even at thicknesses below 1mm. Fill-Pad US1600 has low volatility, low oil bleeding, high insulation properties, good surface wetting and lower thermal resistance, which provides the right amount of residual stress to maintain a good adhesion to the interface and ensures life cycle reliability.
What are the main application scenarios for Fill-Pad US1600?
The typical applications of Thermally Conductive Pad: Fill-Pad US1600
Telecommunications, wireless infrastructure & optical modules
LCD, PDP, and Laser TV Monitor
Industry, LED lighting and power modules
Automotive electronics
Hard disk drives and solid hard disk memory devices
