Techinno Fill-Pad Ultra Soft Series thermal gap pads are engineered for high-power, high-heat devices. They require minimal compression force to perfectly conform to large dimensional tolerances and complex multi-gap structures.
Typical Applications
-
Telecommunications, Wireless Infrastructure & Optical Modules -
LCD, PDP, and Laser TV Monitor -
Industry, LED Lighting and Power Modules -
Automotive Electronics -
Hard Disk Drives and Solid Hard Disk Memory Devices
Specifications
Related Product
FAQ
Main Application Scenarios
Telecommunications, wireless infrastructure & optical modules
It is used for gap heat conduction of communication core chips. With soft material and high conformability, it efficiently dissipates operating heat of chips to ensure long-term stable operation of optical modules.
LCD, PDP and laser TV displays
It fits heat dissipation for display panel drive chips, cushions assembly stress and evenly transfers heat to prevent abnormal screen colors caused by high temperature.
Industry, LED lighting and power modules
It fills assembly gaps of LED beads and industrial power modules, delivers stable continuous heat conduction, alleviates high-temperature aging and extends the service life of lighting and industrial power supplies.
Automotive electronics
It is suitable for gap heat dissipation of vehicle control mainboards and power components. Its highly compressible soft material adapts to bumpy vehicle conditions for reliable temperature control.
Hard disk drives and solid hard disk memory devices
It closely attaches to the surface of storage control chips and flash particles for rapid heat dissipation, regulates operating temperature and avoids read-write lag and hardware loss due to overheating.
To ensure that Thermally Conductive Pad (Ultra Soft Series) maintains stable thermal conductivity and workability within its shelf life, please follow the storage requirements below:
Environmental conditions (applicable to all forms)
① Temperature: 0 °C to 35 °C
② Relative humidity: ≤ 65 % RH
③ Avoid direct sunlight, high temperature, high humidity, or corrosive gas environments.
Shelf life
12 months from the date of packaging. After the shelf life has expired, it is recommended to first verify the thermal performance before further use; only continue use if the product passes verification.
The packaging of Thermally Conductive Pad (Ultra Soft Series) shall comply with the following requirements:
Avoid contamination and compression, control temperature and humidity while keeping away from light, seal to prevent scratches, and limit stacking height.
Before use, inspect the thermally conductive pad for any signs of damage, scratches, bubbles, deformation, contamination, hardening, oil bleed, or cracking. If any are found, please discard it immediately and replace it with a new one.
-
- Thickness Tolerance: >1mm, ±10%; 0.5-1mm, ±0.1mm
- The thickness can be customized according to requirement.Please inquire the available thickness before ordering
- Custom sized configurations and/or cut parts are available with dimensions less than 457*457mm
- Versions A1 or NT1 can be supplied according to customer’s requirements. (A1: Single-sided tackified; NT1: Single-sided de-tackified)
For more ordering information (such as minimum order quantity, lead time, sample requests, etc.), please contact our sales or technical support team.
① Do not eat
② Store away from children
③ Store away from combustion source
④ Please use in reference to MSDS
⑤ Keep the application interface clean
