Driven by on-device large models, AR navigation and multi-screen interactive functions, modern intelligent cockpits require ever-increasing computing power. The soaring power consumption of main SoC chips brings severe heat dissipation challenges, becoming a core bottleneck restricting cockpit domain controller performance and reliability. Against this backdrop, high-performance thermal interface materials have become essential guarantees for stable operation of intelligent cockpit systems.
Cockpit domain controllers face severe thermal challenges from concentrated chip heat in compact enclosures and harsh vehicle operating conditions including vibration and extreme temperature fluctuations. These factors compromise heat dissipation stability, making high-performance thermal interface materials indispensable.
Featuring high thermal conductivity, ultra-low BLT and outstanding reliability, Techinno Fill-CIP 2100 perfectly solves these pain points as an optimal thermal solution for intelligent cockpit domain control systems. 
Core Advantages
- Thermal conductivity: 10.0W/m-K
- Easy for auto-dispensing
- Good surface wetting
- Good thixotropic
- High compressibility for low stress applications
- Excellent slump resistance and high shear thinning characteristics
- Good long-term reliability
What Makes Techinno Fill-CIP 2100 Stand Out?
Efficient Thermal Conduction
Featuring 10.0 W/m-K high thermal conductivity, Fill-CIP 2100 efficiently dissipates heat from high-power SoC chips to meet strict cooling requirements. It balances high thermal performance and excellent fluidity, fully compatible with high-speed automated production lines to improve assembly efficiency and production stability.
Ultra-Low BLT
Thanks to excellent thixotropy, the material achieves ultra-low BLT below 0.2 mm under low compression. It effectively fills interfacial gaps, avoids chip cracking caused by stress concentration, lowers thermal resistance, and improves overall heat dissipation efficiency and product service life.
Superior Long-Term Reliability
Validated by 150°C high-temperature aging, -40°C~150°C Thermal Shock and 85°C/85% RH high-temperature & high-humidity aging tests, Fill-CIP 2100 maintains stable thermal performance with negligible attenuation under extreme conditions.
After curing, it forms a flexible 3D elastic structure with ultra-low residual and compressive stress, protecting delicate chips and components. It delivers consistent thermal performance against vehicle vibration and mechanical shocks, ensuring long-term stable heat dissipation.
Professional mechanical tests confirm no displacement or cracking during anti-vibration and anti-slumping evaluation, enabling reliable operation under complex automotive working conditions and enhancing end-product durability and safety.
Summary
Techinno Fill-CIP 2100 is a curable thermal conductive gel with high thermal conductivity, ultra-low BLT and superior reliability, providing stable and high-performance thermal management for intelligent cockpit domain controllers.
Focused on thermal management innovation, Techinno delivers scenario-based customized materials and solutions to empower the steady development of new energy vehicle electronics.
