Liquid Metal Model:Fill-LM 2500
25W/mK liquid metal:Fill-LM 2500
- High thermal conductivity
- Ultra-low thermal resistance
- Low viscosity
- Non-volatile, high temperature tolerance
- Chemically stable and high reliability
- Datasheet

What is the Liquid Metal Fill-LM 2500?
Fill-LM 2500 is a kind of gallium based liquid alloy material that is liquid at room temperature. It has extremely high thermal conductivity of 25W/m-K, and the porperty of low viscosity enables it to fill the interface gap well. It can provide extremely low interface thermal resistance in the application of high heat generation devices and heat sink interfaces, greatly improve the heat dissipation efficiency, and quickly transfer the heat generated by electronic devices. The product is chemically stable, not easy to oxidize and decompose, and can still maintain good thermal conductivity after many cycles of long-term use.
Fill-LM2500 can be applied to high-performance laptops, game consoles, workstations, servers and other electronic devices for heat dissipation of CPUs, GPUs and other chips. It can greatly reduce the operating temperature of the chip and improve the performance and stability of the device.


What are the main application scenarios for Fill-LM 2500?
The typical applications of Liquid Metal LM2500
CPU, GPU and other chip-set
High-performance laptops, game consoles
Consumer Electronics
Workstations, servers and other electronic equipment







