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Liquid Metal Model:Fill-LM 800

8.0W/mK liquid metal:Fill-LM 800

  • High thermal conductivity
  • Ultra-low thermal resistance
  • Good wetting, handling and reworking
  • Good thixotropy, not flowable to avoid short circuit
  • High reliability, no pump out/dry out, no crack/slump
  • No corrosion of copper

What is the Liquid Metal Fill-LM 800?

Fill-LM 800 is a high performance liquid composite made of liquid metal, polymer and thermally conductive fillers, with very excellent thermal conductivity and thermal resistance performance. It is used for the high power components to improve the reliability by providing extremely low thermal resistance because of its good thixotropy, wettability and ductility. Fill-LM 800 can fulfill the gaps and uneven surface of the interface, to form better contact and enhance the thermal conductive efficiency.
This product is easy to be printed on the bare die or heat sink, and has improved the disadvantages of pure liquid metal such as easy to flow, high surface tension, inherent corrosion to metal through bi-continuous liquid metal and polymer phases.
Fill-LM 800 is designed for high-performance electronic products to put forward stringent requirements on heat dissipation, both printing and dispensing process are supported. Materials are packed in cartridge or tanks.

What are the main application scenarios for Fill-LM 800?

The typical applications of Liquid Metal LM800

CPU, GPU and other chip-set
Memory equipment
Consumer Electronics
Automotive Electronics
TV, game console, etc

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