Fueled by data centers, cloud computing and AI, high-speed optical modules (800G/1.6T/3.2T) are advancing toward higher bandwidth, smaller footprints and higher power density. This trend creates severe thermal challenges, raising strict requirements for premium thermal interface materials to avoid overheating and thermal failure.   Tailored for next-gen high-speed optical modules,Techinno’s […]

1.Thermal Management Solutions for AI Server Chips: Cold Plate & Immersion Liquid Cooling Dual Routes Driven by surging AI computing loads, CPU, GPU and TPU chips generate massive heat, with liquid cooling rapidly replacing air cooling. Cold plate liquid cooling stands as the mainstream choice for liquid-cooled data centers thanks

AI large models keep expanding, pushing computing demand to surge sharply. This puts heavy pressure on optical interconnection in cloud data centers. 1.6T optical modules are widely commercialized, and 3.2T+ products will launch soon. High-speed optical modules are vital for AI clusters to realize high bandwidth, low power consumption and

Fast AI upgrades and soaring computing power push data centers into an era of ultra-high power density. Tightly packed CPUs, GPUs, optical modules and other chips leave minimal space, creating tough cooling hurdles:   1.Intense localized heat buildup from dense high-power chips, triggering throttling and system crashes 2.High interface thermal

On October 29, 2025, the 2025 (4th) Global Conference on Innovation, Development and Application Technology of Liquid Cooling Systems for Data Centers grandly kicked off in Hangzhou. As a highly influential technical exchange platform in the industry, this conference brings together renowned experts, representatives of pioneering enterprises and top research