Curable Thermally Conductive Gel: Fill-CIP 2100

What is the Curable Thermally Conductive Gel Fill-CIP 2100？

Fill-CIP 2100 is a high-performance, two-component, liquid gap filler with the thermal conductivity of 10.0W/m-K, which can offer long-term reliability and high flow rate. Prior to curing, the material maintains good thixotropy, and making it easy to dispense. The mixed material in 1:1 ratio will cure at room temperature and can be accelerated with the addition of heat. Its excellent wettability minimizes thermal resistance at interfaces, while maintaining excellent performance in vertical or vibration applications. Compared with traditional gap pads, Fill-CIP 2100 is fluid before curing, has no large compression deformation above the minimum BLT. Therefore, it’s ideal for applications where uneven gap tolerances are present and filling variable gaps between multiple components and a common heat sink.