Curable Thermally Conductive Gel: Fill-CIP 240
4.0W/mK Curable Thermally Conductive Gel: Fill-CIP 240
- Thermal conductivity: 4.0W/m-K
- Easy for auto-dispensing
- Low viscosity and good wetting
- Good thixotropic
- High compressibility for low stress applications
- Excellent collapse resistance and high shear thinning characteristics
- Good long-term reliability
- Datasheet
What is the Curable Thermally Conductive Gel Fill-CIP 240？
Fill-CIP 240 is a high-performance, two-component, liquid gap filler with the thermal conductivity of 4.0W/m-K, which can offer long-term reliability and high dispensable rate. Prior to curing, the material maintains good thixotropy to be easily dispensed. The mixed material in 1:1 ratio will cure at room temperature and can be accelerated with the addition of heat. The high compressibility and excellent wettibility can minimize thermal resistance at interfaces, while maintaining excellent performance in vertical or vibration applications.
The liquid approach offers thickness variations with little to no stress to sensitive components during assembly. After curing, Fill-CIP 240 provides a soft, form-in place elastomer that is ideal for fragile assemblies or for filling intricate air voids.
What are the main application scenarios for Fill-CIP 240?
The typical applications of Curable Thermally Conductive Gel Fill-CIP 240
Automotive electronics and battery
Industry, LED lighting and power modules
Telecommunications equipments
Smart phone and consumer electronics
Large storage data center
Power electronics
