Curable Thermally Conductive Gel: Fill-CIP 260
6.0W/mK Curable Thermally Conductive Gel: Fill-CIP 260
- Thermal conductivity: 6.0W/m-K
- Easy for auto-dispensing
- Low viscosity and good wetting
- Good thixotropic
- High compressibility for low stress applications
- Good long-term reliability
- Excellent collapse resistance and high shear thinning characteristics
- Datasheet
What is the Curable Thermally Conductive Gel Fill-CIP 260？
Fill-CIP 260 is a high-performance, two-component, liquid gap filler with the thermal conductivity of 6.0W/m-K, which can offer long-term reliability and high dispensable rate. Prior to curing, the material maintains good thixotropy to be easily dispensed. The mixed material in 1:1 ratio will cure at room temperature and can be accelerated with the addition of heat. The high compressibility and excellent wettibility can minimize thermal resistance at interfaces, while maintaining excellent performance in vertical or vibration applications.
The liquid approach offers thickness variations with little to no stress to sensitive components during assembly. After curing, Fill-CIP 260 provides a soft, form-in place elastomer that is ideal for fragile assemblies or for filling intricate air voids.
What are the main application scenarios for Fill-CIP 260?
The typical applications of Curable Thermally Conductive Gel Fill-CIP 260
Automotive electronics and battery
Industry, LED lighting and power modules
Large storage data center
Smart phone and consumer electronics
Telecommunications equipments
Power electronics
