Curable Thermally Conductive Gel: Fill-CIP 220
2.0W/mK Curable Thermally Conductive Gel: Fill-CIP 220
- Thermal conductivity: 2.0W/m-K
- Easy for auto-dispensing
- Low viscosity and good wetting
- Low volatiles, Low siloxanes
- High compressibility for low stress applications
- Good long-term reliability
- Datasheet
What is the Curable Thermally Conductive Gel Fill-CIP 220？
Fill-CIP 220 is a two-component, thermally conductive, gap filling material with a thermal conductivity of 2.0W/m-K. The uncured product has excellent thixotropy, making it easy for dispensing and anti-sag property. The mixed system will cure at room temperature and can be accelerated with additional heat.
The liquid approach offers thickness variations with little to no stress to sensitive components during assembly. After curing, Fill-CIP 220 provides a soft, form-in place elastomer that is ideal for fragile assemblies or for filling intricate air voids.
What are the main application scenarios for Fill-CIP 220?
The typical applications of Curable Thermally Conductive Gel Fill-CIP 220
Automotive electronics and battery
LED lighting
Telecommunications equipments
Smart phone and consumer electronics
Large storage data center
Power electronics
