Curable Thermally Conductive Gel: Fill-CIP 235
3.5W/mK Curable Thermally Conductive Gel: Fill-CIP 235
- Thermal conductivity: 3.5W/m-K
- Easy for auto-dispensing
- Low viscosity and good wetting
- Fast cured or adjustable cured profile
- High compressibility for low stress applications
- Good long-term reliability
- Datasheet
What is the Curable Thermally Conductive Gel Fill-CIP 235？
Fill-CIP 235 is a two-component, thermally conductive, gap filling material with a thermal conductivity of 3.5W/m-K. The uncured product has excellent thixotropy, making it easy for dispensing and anti-sag property. The mixed system will cure at room temperature and can be accelerated with additional heat.
The liquid approach offers thickness variations with little to no stress to sensitive components during assembly. After curing, Fill-CIP 235 provides a soft, form-in place elastomer that is ideal for fragile assemblies or for filling intricate air voids.
What are the main application scenarios for Fill-CIP 235?
The typical applications of Curable Thermally Conductive Gel Fill-CIP 235
Automotive electronics and battery
Industry, LED lighting and power modules
Telecommunications equipments
Smart phone and consumer electronics
Large storage data center
Power electronics
