Curable Thermally Conductive Gel: Fill-CIP 220LD
2.0W/mK Curable Thermally Conductive Gel: Fill-CIP 220LD
- Thermal conductivity: 2.0W/m-K
- Low density: 2.0g/cm3
- Easy for auto-dispensing
- Low viscosity and good wetting
- Fast cured or adjustable cured profile
- High compressibility for low stress applications
- Datasheet
What is the Curable Thermally Conductive Gel Fill-CIP 220LD？
Fill-CIP 220LD is a low density, two-component liquid gap filler with the thermal conductivity of 2.0W/m-K, which can offer long-term reliability and high dispensable rate. The uncured product has excellent thixotropy, making it easy for dispensing and anti-sag property. The mixed system will cure at room temperature and can be accelerated with additional heat.
The liquid approach offers thickness variations with little to no stress to sensitive components during assembly. After curing, Fill-CIP 220LV provides a soft, form-in place elastomer that is ideal for fragile assemblies or for filling intricate air voids.
What are the main application scenarios for Fill-CIP 220LD?
The typical applications of Curable Thermally Conductive Gel Fill-CIP 220LD
Automotive electronics and battery
Industry, LED lighting and power modules
Telecommunications equipments
Smart phone and consumer electronics
Large storage data center
Power electronics
