In modern electronic systems, nearly 80% of the electrical power dissipated into an electronic device becomes waste heat due to the limitations of the device’s own efficiency. Research results from the U.S. Air Force Avionics Overall Research Program show that 55% of device failures are caused by temperature factors.

In recent years, the explosion of photovoltaics, electric vehicles, 5G communications, mobile electronics and other fields has brought higher and higher requirements for the heat dissipation of devices. Now, energy storage, medical, lasers and other industrial manufacturing and assembly fields have put forward more diversified requirements for thermally conductive interface materials, so that they are no longer confined to the enhancement of thermal conductivity alone, but are developing in the direction of multifunctionality, including dielectricity, insulation, high reliability, flame retardancy and many other aspects, so as to be able to better adapt to the specific needs of each field, thereby promoting the relevant industries to realize technological progress and innovation.