Apple has launched the MacBook Air and MacBook Pro with its latest chip, the M2.

At the Apple Worldwide Developers Conference (WWDC) 2022, Apple unveiled its new M chip, the M2. From apple's M2 and M1 chip perspective chart, the M2 chip has a larger area, and the number of transistors also exceeds 20 billion (the M1 is 16 billion).

According to the released data, the M2 improvement on the CPU is not high, but it is not ruled out that Apple retains a certain frequency increase space for subsequent release. In addition, Apple officials have said that the M2's GPU has increased by nearly 35%.

But higher performance often tends to have higher power consumption, which means that the product is more demanding on heat dissipation. For a laptop, the cooling system is a very important part, it directly affects the CPU / GPU performance, and whether it can last enough to play. The higher performance product, the higher requirements of heat dissipation.

Generally speaking, in the whole heat dissipation system, the thermal conductivity material is the closest contact of the "heat source", which can fully fill the gap between the heat sink and the chip, eliminate the air inside, improve the heat dissipation effect.

At present, the mainstream thermal conductive materials used in the market for laptop applications are mostly thermally conductive silicone greases. With the improvement of the reliability demand, the phase-change material PCM has gradually gained a place in the high-end laptop. 

But due to the filling amount and raw material system, both thermal silicone grease and PCM have reached the limit of thermal resistance reduction,some high-performance game chips have too late to conduct the heat wave through traditional silicone grease and phase change materials.

 In recent years, many laptop plants specializing for high-performance games, such as Asus ROG game laptop and SONY's PS5, have already adopted the liquid metal design to reduce the temperature of CPU and the risk of chip overheating and failure.

However, the corrosiveness of liquid metal to copper and aluminum radiators, the wettability problem caused by excessive surface tension on the metal surface, and the fluidity and conductivity of liquid metal itself have brought many restrictions, risks, and production efficiency to the application. And the cost of use, which is also an important reason why most manufacturers still stay away from liquid metal.

The new generation of low BLT thermally conductive materials for CPU and GPU have the following characteristics:

• Higher thermal conductivity and extremely low thermal resistance
• No pump out, dry out, good long-term reliability
• Good thixotropy, no leakage, avoid short circuit to surrounding circuits
• Good wettability, easy to print
• Not corrosive to heat sinks such as copper and nickel-plated plates

Therefore, Techinno's R&D personnel carried out a "transformation and grafting" of traditional liquid metal and silicone grease technology according to the pain points and needs of customers, and developed Fill-LM800 liquid metal composite.

Fill-LM800 Liquid Metal Composite

Fill-LM800 is a high performance liquid composite made of liquid metal, polymer and thermally conductive fillers, with very excellent thermal conductivity and thermal resistance performance. It is used for the high power components to improve the reliability by providing extremely low thermal resistance because of its good thixotropy, wettability and ductility. Fill-LM800 can fulfill the gaps and uneven surface of the interface, to form better contact and enhance the thermal

conductive efficiency. This product is easy to be printed on the bare die or heat sink, and has improved the disadvantages of pure liquid metal such as easy to flow, high surface tension, inherent corrosion to metal through bi-continuous liquid metal and polymer phases.

Fill-LM800 is designed for today's high-performance electronic products to put forward stringent requirements on heat dissipation, both printing and dispensing process are supported. Materials are packed in cartridge or tanks.

Features

• High thermal conductivity
• Ultra-low thermal resistance
• Good wetting, handling and reworking
• Good thixotropy, not flowable to avoid short circuit
• Good thixotropy, not flowable to avoid short circuit
• High reliability, no pump out/dry out, no crack/slump
• No corrosion of copper

Typical Application

• CPU, GPU and other chip-set
• IGBT
• Memory equipment
• Consumer Electronics
• TV, game console, etc
• Automotive Electronics

Many laptop manufacturers will set a corresponding "temperature wall" or "power wall" according to the quality of a product's heat dissipation capacity, which means that it will limit the performance of the CPU or GPU to different degrees to avoid overheating. Then, in a sense, the Fill-LM 800 with strong thermal conductivity can improve the performance of the notebook to a certain extent.

In practical application, the stability and reliability of Fill-LM800 have good performance.

Thermal Stability For Transportation and Storage

After Fill-LM800 is printed on the substrate, it may not be assembled immediately, and there may be links such as transportation and storage in the middle. Fill-LM800 has excellent thermal stability, and still has good shape retention under long-term vibration conditions, without sliding, deformation, vertical flowing, and phase separation.

Thermal Resistance Reliability

The thermal resistance of Fill-LM 800 can be stable under continuous high temperature, high and low temperature shock and HAST test conditions, which is very suitable for the long-term use of some high-performance notebook computers. It is especially friendly to some laptops that choose passive cooling because of their lightness and portability.

In general, Fill-LM800 liquid metal composite has excellent thermal conductivity, and the paste-like form can fully fill the gap between the heat sink and the chip, helping the chip to dissipate heat quickly.Its excellent craftsmanship, stability and reliability also reduce the loss that may occur in the production and transportation process of related manufacturers, and save costs to a certain extent.

In addition, Fill-LM 800 is non-corrosive to materials such as silicon wafers, stainless steel, nickel-plated plates, anodized aluminum plates, and copper, reducing restrictions on thermal design.

In a word, Fill-LM800 liquid metal composite learns from others' strengths, provides an excellent thermal management solution for high-performance notebook computers, and is expected to become the thermal solution for the next generation of CPU/GPU.