Techinno Fill-PTXXXXs are putty pads designed for applications requiring low compression force to conform over irregular interfaces and allow low thermal impedance. The network cross-linked polymer structure provides superior long term reliability over dispensable gel. The material’s putty-like design enables excellent gap-filling capability for applications with large dimensional variances or multiple gaps. Meanwhile, these products have good handling performance just like the traditional pads during high volume assembly. Fill-PT series have good tack surface and requires no additional adhesive to mate to heat source or heat sink.