Gap Filler
Fill-Pad Series
Gap Pad is a kind of high-performance gap-filling thermally conductive material synthesized by a special process using resin-based material with metal oxides and other auxiliary materials, mainly designed to accommodate a wide gap rang of the heat transfer interface between electronic devices and heat sinks or metal covers.
Fill-PT Series
Fill-PT series products are putty pads pressed from thermally conductive gel through a special process. This series of products combines the low stress characteristic of gel with the application process of gap pad, and achieves extremely minimal compression stress and residual stress while filling multiple gaps of different heights.
Fill-Gel Series
Fill-Gel Series is a family of paste-like material which is mixed with thermally conductive ceramic powder and silicone gel. It is fully cured and dispensable, requiring no mixing or curing, and is an ideal type of material for filling gaps of different heights under lower pressure.
Fill-CIP Series
Cure-In-Place (CIP) Gap Filler is two-part, dispensable thermally conductive gel, which offers low viscosity and high shear thinning property while two-component mixed in 1:1 ratio. After curing, this product will form a 3D elastomer structure with low compression stress to protect sensitive components from damage.
