Thermal Conductivity Solutions for UAVs
Techinno Solution:Fill-Gel 1000
Thermally conductive interface materials for UAVs should have low density, low volatility, vibration resistance and easy handling. Considering the ease of production process and the management cost of large-scale production, Techinno recommends Fill-Gel 1000 as the solution.
Features
Thermal Conductivity: 10.0W/m-K
High reliability and thermal stability
Low volatiles and siloxane content
High compressibility for low stress applications
Low contact resistance
No pump-out, no crack/slide at thermal cycling and vibration environment
Typical Applications
Chassis or the associated cooling module
Heating with low assembly pressure
Smart terminals, mobile phone, tablet computer
Telecommunication base station
Large storage data center
Memory & Power Modules
Detailed Explanation of Materials
Thermal properties of Fill-Gel 1000
Techinno Fill-Gel 1000 has good thermal properties, with good thermal resistance under low pressure, high thixotropy, high deformation at low pressure, and large tolerance interfaces to fill the interface gaps, avoiding localized temperature differences in components caused by uneven thermal conductivity.
Flow Rate Test of Fill-Gel 1000
The unique formulation design allows Fill-Gel 1000 to achieve an actual flow rate of 23g/min (30cEFD tube, 2.5mm orifice diameter 90psi60s) with good long term reliability.
Reliability of Fill-Gel 1000
Fill-Gel 1000 has a stable thermal resistance throughout the aging test.Fill-Gel 1000 has stable thermal resistance performance throughout the reliability test. Under the high temperature aging test, thermal shock test and HAST,Fill-Gel 1000 can maintain its initial thermal performance without any sign of thermal conductivity decline.
