Fill-Pad Low Dielectric Constant Series
Techinno Fill-Pad Low Dielectric Constant Series thermal conductive pad products are ceramic powder filled silicone resin pads.The products have good surface wetting capability minimizes the interface thermal impedance. Fill-Pad Low Dielectric Constant Series products provide excellent thermal conductivity and excellent mechanical properties, as well as low dielectric constant,which absorb vibration and relieves stress, reduces dielectric loss and signal attenuation, and is particularly suitable for signal-sensitive applications..
The thermal pads are naturally tacky and require no additional adhesive for mating. Also single side adhesive or single side non-tacky surface treatment are available for special application.
Related Products
Features
Low dielectric constant
High insulation
Lower hardness, excellent fit
Absorb vibration and reduce stress
Typical Application
Microwave components for semiconductor devices
5G base station communication devices
RF module
WIFI module
Storage and Shelf Life
| Storage under 0-35℃, ≤65% R.H. | 12 months from date of packing |
Ordering Information
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Thickness Tolerance: ≥1mm，±10%; 0.5-1mm，±0.1mm |
The thickness can be customized according to requirement. Please inquire the available thickness before ordering. |
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Custom sized confgurations and/or cut parts are available with dimensions less than 457*457mm. |
Versions A1 or NT1 can be supplied according to customer's requirements. |
Property
