About Us
Techinno Technology was founded in 2018, with a total plant area of more than 6,000 square meters and a total investment of more than 50 million yuan, around the electronic product chip level, system level, board level and device level functional requirements to provide the overall solution of electronic materials, focusing on the research and development, manufacturing and sales of high-end thermally conductive interface materials (TIM1, TIM1.5 & TIM2), to provide customers with integrated solutions!
Founded
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Total plant area(m²)
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Investment(million yuan)
Techinno Product
Domain Controller Thermal Solution
Electric Vehicle Motor Controller Thermal Conductivity Solutions
Thermal Conductivity Solutions for Electric Vehicle Air Conditioning Compressor Controllers
Lidar Thermal Solutions
AI Server Thermal Conductivity Solutions
VR Thermal Conductivity Solutions
Thermal Conductivity Solutions for UAVs
Domain Controller Thermal Solution
Electric Vehicle Motor Controller Thermal Conductivity Solutions
Thermal Conductivity Solutions for Electric Vehicle Air Conditioning Compressor Controllers
Lidar Thermal Solutions
AI Server Thermal Conductivity Solutions
VR Thermal Conductivity Solutions
Thermal Conductivity Solutions for UAVs
News Information
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Driven by rapid AI iteration and surging computing power, data centers enter a high power density era. Highly integrated onboard hardware squeezes CPUs, GPUs, optical modules and other core parts into limited space, bringing great challenges to thermal management. 1. Extreme local heat flux. Dense high-power chips cause accumulated heat, leading to frequency reduction and system downtime. 2. High interfacial thermal resistance. Micro gaps between components form air barriers and weaken heat dissipation. 3. Hidden reliability risks. Precision parts are vulnerable to pressure damage. Thermal materials need low outgassing, silicone-free property and stable performance under high temperature. Techinno Fill-Pad US1600 Silicone-free Thermal Pad Techinno officially launches the Fill-Pad US 1600 high-performance silicone-free thermal pad, which is tailor...
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Driven by rapid AI iteration and surging computing power, data centers enter a high power density era. Highly integrated onboard hardware squeezes CPUs, GPUs, optical modules and other core parts into limited space, bringing great challenges to thermal management. 1. Extreme local heat flux. Dense high-power chips cause accumulated heat, leading to frequency reduction and system downtime. 2. High interfacial thermal resistance. Micro gaps between components form air barriers and weaken heat dissipation. 3. Hidden reliability risks. Precision parts are vulnerable to pressure damage. Thermal materials need low outgassing, silicone-free property and stable performance under high temperature. Techinno Fill-Pad US1600 Silicone-free Thermal Pad Techinno officially launches the Fill-Pad US 1600 high-performance silicone-free thermal pad, which is tailor...
