Fill-Pad Ultra Thin Series
Techinno Fill-Pad UT Series thermal conductive pad products are designed for the ultra thin interface.The products have good surface wetting, insulation and excellent mechanical properties. The thermal conductivity of Fill-Pad UT Series are from 3.0 to 8.0 W/m-K, the thickness ranges are from 0.2mm to 1.0mm. Fill-Pad UT Series are especially suitable for applications which is ideal for the thermal solutions of low pressure stress and handled devices.
The thermal pads are naturally tacky and require no additional adhe sive for mating. Also single side adhesive or single side non-tacky surface treatment are available for special application.
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Features
Good surface wetting property
The thickness ranges are from 0.2mm to 1.0mm
High reliability
Low compression force
Typical Application
Telecommunications，wireless
IGBT Module
Industry，LED lighting and power modules
Automotive electronics
Hard disk drives and solid hard disk memory devices
Consumer Electronics
Storage and Shelf Life
| Storage under the condition of 0-35℃，≤65%RH | The shelf life is 12 months after packing |
Ordering Information
| Thickness range: ±0.1mm | The thickness can be customized according to requirement. Please inquire the available thickness before ordering. |
Property
