Motor Controller Thermal Conductivity Solution
Techinno Solution:Fill-PCM 800SP
To cope with the huge heat generation of high-power IGBTs, Techinno has developed a high-performance thermally conductive phase change composite material, Fill-PCM 800SP, which is specially designed for the fast thermal conductivity of high-power heat-generating components.
Feature
Extremely low thermal resistance
Silicone free, no silicone contamination
Paste-like products have a low viscosity, easy to print
High reliability, no pump out/dry out/crack/slump in long term application
Good handling and reworkability
Soft at room temperature
Typical Applications
CPU, GPU, and other chipset
IGBT Module
Memory Modules
Consumer Electronics
Automotive
TV, game console, etc
Detailed Explanation of Materials
Thermal Performance of Fill-PCM 800SP
Fill-PCM 800SP has a very low viscosity in the molten state, so low BLT can be achieved very quickly at very low pressures, and the very low BLT brings lower thermal resistance, so Fill-PCM 800SP can achieve low thermal resistance at low pressures, and improve the efficiency of thermal conductivity.
Reliability of Fill-PCM 800SP
Fill-PCM 800SP has a stable thermal resistance throughout the aging test. Fill-PCM 800SP has stable thermal resistance performance throughout the reliability test. Under the high temperature aging test, thermal shock test and HAST, Fill-PCM 800SP can maintain its initial thermal performance without any sign of thermal conductivity decline.
Reliability comparison between FiII-PCM 800SP and silicone grease
Using the IGBT module in the -40 ~ 125 ℃ environment for 1000 times of hot and cold cycle test, the silicone grease appeared obvious dumpout, Fill-PCM 800SP does not have any "hot spot".
