Fill-TPM series is soft at room temperature and self-adhesive on the surface, providing excellent handling and reworking properties. This series has higher cohesion and self-healing ability, which can effectively prevent the large-size chips from warpage due to uneven heat generation, resulting in pump out. The products have excellent thermal conductivity and can meet the heat dissipation requirements of high power chips, and can be supplied in rolls, sheets or customized shapes and sizes to meet the needs of different customers.