Fill-CIP is a family of cure-in-place liquid thermal interface material. Fill-CIP series are two-part, dispensable thermally conductive gel, which offer long-term reliability and high dispensable rate. Prior to curing, the material maintains good thixotropic characteristics and low viscosity to be easily dispensed. The product can be cured in short time after two-component mixing at room temperature and can be cured faster under higher temperature. The high compressibility minimizes thermal resistance at interfaces, while maintaining excellent performance in vertical or vibration applications.