Phase Change Material (PCM) is designed to minimize thermal resistance between high power component and heat sink, and offers very stable thermal resistance to enhance the reliability of the device. Fill-PCM is solid at room temperature and is easy to cut and conve nient to apply. When it reaches above the phase change temperature, PCM starts to soften and exhibit excellent wetting property. The low viscosity facilitates better filling of the tiny gaps to get extremely low surface contact resistance. The robust polymer provides superior reliability and maintains low thermal impedance, making PCM desirable for high-performance integrated circuit devices