Fill-Pad General Series
Techinno Fill-Pad General Series thermal conductive pad products are made of resin and thermal conductive fillers that designed for different application requirements. The Fill-Pads have good surface wetting, flexibility and high compressibility properties. The thickness ranges are from 0.5mm to 5.0mm. The thermal pads are naturally tacky and require no additional adhesive for mating. Also single side adhesive or single side non-tacky surface treatment are available for special application.
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Features
Good surface wetting property
Flexible，high compressibility for low stress applications
Low oil bleeding
Good handling
Easy to rework
Excellent reliability
Typical Applications
Telecommunications，wireless
Optical modules
Industry，LED lighting and power modules
Automotive electronics
Hard disk drives and solid hard disk memory devices
Storage and Shelf Life
| Storage under the condition of 0-35℃，≤65%RH | The shelf life is 12 months after packing |
Ordering Information
| Thickness Tolerance: >=1mm，±10%; 0.5-1mm，±0.1mm | The thickness can be customized according to requirement. Please inquire the available thickness before ordering. |
Property
