Low BLT Material
Fill-PCM Series
Thermally Conductive Phase Change Material (PCM) mainly solves the increasingly serious reliability problems of silicone grease, such as pump out and dry out, and improves the service life of the equipment. It is more suitable for low BLT scenarios such as IGBTs, GPUs, laptop CPUs, and other DIEs where heat generation is more intensive and the loss of silicone grease is more serious.
Fill-Grease Series
Thermal Grease is a kind of thermal interface material with good thermal conductivity, mainly used in low BLT (<0.2mm) gap filling scenarios, to ensure the stability of the electrical performance of electronic instruments.
Fill-LM Series
Techinno Fill-LM Series is a flowable liquid metal or solid metal sheet, it is a series of low melting point metals as well as alloy materials collectively, with the properties of high electric conductivity, high thermal conductivity, low viscosity, non-volatile, compatible with all the coolant and controllable melting point.
Fill-TPM Series
Techinno Fill-TPM is a special ultra-thin thermally conductive interface material. Based on the special formula design and preparation process, this series of products has higher cohesion, and better self-repairing properties, can effectively prevent high power equipments from large area warping or pump out caused by uneven heating, especially suitable for high power, large size and large warping scenarios.
