Fill-Pad Silicone Free Series
Techinno Fill-Pad SF Series thermal conductive pad products are kinds of ceramic silicone-free composite, which have good thermal conductivity, surface wetting and mechanical properties. The products are especially suitable for applications which is sensitive to siloxane. Fill-Pad SF Series products have very low outgassing and low oil bleeding performance.
The thermal pads are naturally tacky and require no additional adhe sive for mating. Also single side adhesive or single side non-tacky surface treatment are available for special application.
Related Products
Features
Good surface wetting property
Silicone free, no silicone contamination
Low oil bleeding
Low outgassing, D3-D10 (< 100ppm)
Typical Application
Telecommunications，wireless
LCD, PDP, and Laser TV Monitor
Industry，LED lighting and power modules
Automotive electronics
Hard disk drives and solid hard disk memory devices
Camera Module
Storage and Shelf Life
| Storage under the condition of 0-35℃，≤65%RH | The shelf life is 12 months after packing |
Ordering Information
| Thickness Tolerance: >=1mm，±10%; 0.5-1mm，±0.1mm | The thickness can be customized according to requirement. Please inquire the available thickness before ordering. |
Property
